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Laboratory

Associate Professor Eiji Higurashi

 

Eiji Higurashi, Associate Professor of School of Engineering, The University of Tokyo


He received the M.E. and Ph.D. degrees from Tohoku University, Sendai, Japan, in 1991 and 1999, respectively. He was with Nippon Telegraph and Telephone Corporation (NTT), Tokyo, Japan, from 1991 to 2003, where he was engaged in the field of laser manipulation and optical microsensors. He was an associate professor in the Research Center for Advanced Science and Technology (RCAST) at the University of Tokyo from 2004 to 2014 and has been an associate professor in the Department of Precision Engineering at the University of Tokyo since 2003. His current research interests include low-temperature bonding methods and the integration and packaging technology for optical microsystems.

Résumé

  • 1967: born in Ibaraki, Japan
  • 1991: Master of Engineering, Tohoku University
  • 1991: Nippon Telegraph and Telephone Corporation (NTT)
  • 2003: School of Engineering, The University of Tokyo, Associate Professor
  • 2004: Research Center for Advanced Science and Technology (RCAST), The University of Tokyo, Associate Professor
  • 2014 - present: School of Engineering, The University of Tokyo, Associate Professor

Memberships

He is a member of the Japan Society for Precision Engineering (JSPE), the Japan Institute of Electronics Packaging (JIEP), the Japan Society of Applied Physics (JSAP), and the Institute of Electronics, Information, and Communication Engineers (IEICE), and is a Senior Member of the Institute of Electrical Engineers of Japan (IEEJ).

Awards

  • Young Scientist Presentation Award, The Japan Society of Applied Physics (JSAP) (1997)
  • Best Presentation Award, The Japan Society for Precision Engineering (JSPE) Autumn Meeting (1999)
  • Excellent Presentation Award, The Institute of Electrical Engineers of Japan (IEEJ) (1999)
  • Igarashi Award, Sensors and Micromachine Sub-Society of the Institute of Electrical Engineers of Japan (IEEJ) (2002)
  • Microoptics Conference Paper Award (2003)
  • The Okawa Publications Prize, The Okawa Foundation for Information and Telecommunications (2003)
  • ICEPT Best Paper Award (2007)
  • The Ichimura Prize in Science for Distinguished Achievement, The New Technology Development Foundation (2008)
  • SENSORDEVICES Best Paper Award (2010)
  • Outstanding Technical Paper Award, Sensor Symposium on Sensors, Micromachines and Applied Systems, Institute of Electrical Engineers of Japan (IEEJ) (2011)
  • ICEP Outstanding Technical Paper Award (2013)
  • Technical Paper Award, 30th Sensor Symposium on Sensors, Micromachines and Applied Systems, Institute of Electrical Engineers of Japan (IEEJ) (2013)
  • Paper Award, The Japan Society of Applied Physics Silicon Technology Division (2015)
  • Best Paper Award, 24th Micro Electronics Symposium (MES 2014), The Japan Institute of Electronics Packaging (JIEP) (2015)
  • Transducers Outstanding Paper Award (2015)
  • Outstanding Technical Paper Award, Sensor Symposium on Sensors, Micromachines and Applied Systems, Institute of Electrical Engineers of Japan (IEEJ) (2015)
  • ICEP Outstanding Technical Paper Award (2016)

Publications

  • Eiji Higurashi and Tadatomo Suga, A Review of Low-temperature Sealing Technologies using Metal Thin Films and Solders for Sensors and MEMS, IEEJ Transactions on Sensors and Micromachines, vol. 136, no. 6, pp. 266-273 (2016).
  • Eiji Higurashi, Michitaka Yamamoto, Takeshi Sato, Tadatomo Suga, and Renshi Sawada, Room-temperature gold-gold bonding method based on argon and hydrogen gas mixture atmospheric-pressure plasma treatment for optoelectronic devices integration, IEICE Transactions on Electronics, vol. E99-C, no. 3, pp. 339-345 (2016), Invited paper.
  • Eiji Higurashi, Ken Okumura, Kaori Nakasuji, and Tadatomo Suga, Surface activated bonding of GaAs and SiC wafers at room temperature for improved heat dissipation in high-power semiconductor lasers, Japanese Journal of Applied Physics, vol. 54, no. 3, 030207 (2015).
  • Eiji Higurashi, Yuta Sasaki, Ryuji Kurayama, Tadatomo Suga, Yasuo Doi, Yoshihiro Sawayama, and Iwao Hosako, Room-temperature direct bonding of germanium wafers by surface-activated bonding method, Japanese Journal of Applied Physics, vol. 54, no. 3, 030213 (2015).
  • Eiji Higurashi and Tadatomo Suga, Review of Low-temperature Bonding Technologies and Their Application in Optoelectronic Devices, IEEJ Transactions on Senosors and Micromachines, vol. 134, no. 6, pp. 159-165 (2014).
  • Eiji Higurashi, Daisuke Chino, Tadatomo Suga, and Renshi Sawada, Au-Au Surface-Activated Bonding and Its Application to Optical Microsensors with 3-D Structure, IEEE Journal of Selected Topics in Quantum Electronics, vol. 15, no. 5, pp. 1500-1505 (2009).
  • Eiji Higurashi, Teppei Imamura, Tadatomo Suga, and Renshi Sawada, Low temperature bonding of laser diode chips on Si substrates using plasma activation of Au films, IEEE Photon. Tech. Lett., vol. 19, no. 24, pp. 1994-1996 (2007).
  • E. Higurashi and R. Sawada, Micro-encoder based on higher-order diffracted light interference, J. Micromech. Microeng., vol. 15, pp. 1459-1465 (2005).
  • E. Higurashi, R. Sawada, and T. Ito, An Integrated laser blood flowmeter, J. Lightwave Tech., vol. 21, pp. 591- 595 (2003).
  • E. Higurashi, R. Sawada, and T. Ito, Optically induced angular alignment of trapped birefringent micro-objects by linearly polarized light, Phys. Rev. E, 59, 3676-3681 (1999).
  • E. Higurashi, H. Ukita, H. Tanaka, and O. Ohguchi, Optically induced rotation of anisotropic micro-objects fabricated by surface micromachining, Appl. Phys. Lett., vol. 64, no. 17, pp. 2209-2210 (1994).
  • 75 Journal papers, 165 international conference papers, 36 patents.

Special field

Nano and Micro Engineering, Integration and packaging of optical microsystems

Contact

E-Mail: eiji@su.t.u-tokyo.ac.jp

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